Invention Grant
- Patent Title: Connector assembly and method
- Patent Title (中): 连接器组装和方法
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Application No.: US14563641Application Date: 2014-12-08
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Publication No.: US09385457B2Publication Date: 2016-07-05
- Inventor: Gaurav Chawla , Joshua D Heppner , Zhichao Zhang , David J. Llapitan , Vijaykumar Krithivasan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01R24/28
- IPC: H01R24/28 ; H01R12/72 ; H01R12/79 ; H01R13/11 ; H01R12/71 ; H01L23/34 ; H01R12/70

Abstract:
Connectors and methods to couple packages and dies are shown. Selected examples include plugs and receptacles having two or more terraces with contacts provided along the terraces. Examples of connectors and methods include configurations where the connector is usable with a package including a die coupled along a substrate. In selected examples a heat sink is coupled over the die, and a package includes a side access port between the heat sink and the substrate configured to receive the connector, such as one or more of a plug or receptacle through the side access port.
Public/Granted literature
- US20150249298A1 CONNECTOR ASSEMBLY AND METHOD Public/Granted day:2015-09-03
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