发明授权
- 专利标题: Semiconductor devices having plug insulators
- 专利标题(中): 具有插头绝缘体的半导体器件
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申请号: US14481932申请日: 2014-09-10
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公开(公告)号: US09390961B2公开(公告)日: 2016-07-12
- 发明人: Mong-Sup Lee , Byoung-Yong Gwak , Byung-Ho Kwak , Yoon-Kyung Kim , Tae-Joon Park , Byung-Sul Ryu , In-Seak Hwang
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel & Sibley
- 优先权: KR10-2013-0155763 20131213
- 主分类号: H01L21/70
- IPC分类号: H01L21/70 ; H01L21/762 ; H01L27/108
摘要:
Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a first bit line structure extending in a first direction, a second bit line structure extending in the first direction and spaced apart from the first bit line structure, a storage contact plug located between the first bit line structure and the second bit line structure, and extending in a second direction perpendicular to the first direction, a first plug insulator located between the first bit line structure and the second bit line structure, and configured to contact a side surface extending in the second direction of the storage contact plug, and a plug isolation pattern located between the first bit line structure and the first plug insulator.
公开/授权文献
- US20150171163A1 Semiconductor Device and Method of Fabricating the Same 公开/授权日:2015-06-18
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