Invention Grant
US09391176B2 Multi-gate FETs having corrugated semiconductor stacks and method of forming the same
有权
具有波纹状半导体叠层的多栅极FET及其形成方法
- Patent Title: Multi-gate FETs having corrugated semiconductor stacks and method of forming the same
- Patent Title (中): 具有波纹状半导体叠层的多栅极FET及其形成方法
-
Application No.: US14522000Application Date: 2014-10-23
-
Publication No.: US09391176B2Publication Date: 2016-07-12
- Inventor: Stefan Flachowsky , Jan Hoentschel , Ralf Richter , Peter Javorka
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L29/06 ; H01L29/78 ; H01L29/40 ; H01L29/66 ; H01L29/165 ; H01L25/065 ; H01L29/786 ; H01L29/423

Abstract:
The present disclosure provides, in various aspects of the present disclosure, a semiconductor device which includes a semiconductor stack disposed over a surface of a substrate and a gate structure partially formed over an upper surface and two opposing sidewall surfaces of the semiconductor stack, wherein the semiconductor stack includes an alternating arrangement of at least two layers formed by a first semiconductor material and a second semiconductor material which is different from the first semiconductor material.
Public/Granted literature
- US20160118483A1 MULTI-GATE FETS HAVING CORRUGATED SEMICONDUCTOR STACKS AND METHOD OF FORMING THE SAME Public/Granted day:2016-04-28
Information query
IPC分类: