Invention Grant
- Patent Title: Carrier for a semiconductor layer
- Patent Title (中): 载体为半导体层
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Application No.: US14583780Application Date: 2014-12-29
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Publication No.: US09397281B2Publication Date: 2016-07-19
- Inventor: Yi-Keng Fu , Rong Xuan , Hsun-Chih Liu
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/64 ; H01L33/04 ; H01L33/12 ; H01L33/22 ; H01L33/20 ; H01L33/02 ; H01L33/06

Abstract:
A carrier for carrying a semiconductor layer having a growth surface and at least one nano-patterned structure on the growth surface is provided. The at least one nano-patterned structure on the growth surface of the carrier has a plurality of mesas, a recess is formed between two adjacent mesas, in which a depth of the recess ranges from 10 nm to 500 nm, and a dimension of the mesa ranges from 10 nm to 800 nm.
Public/Granted literature
- US20150137332A1 CARRIER FOR A SEMICONDUCTOR LAYER Public/Granted day:2015-05-21
Information query
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