发明授权
- 专利标题： Semiconductor packaging structure and method
- 专利标题（中）： 半导体封装结构及方法
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申请号： US13357379申请日： 2012-01-24
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公开(公告)号： US09412689B2公开(公告)日： 2016-08-09
- 发明人: Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
- 申请人： Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/498 ; H01L25/10 ; H01L23/00
摘要：
A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.
公开/授权文献
- US08878352B2 Semiconductor packaging structure and method 公开/授权日：2014-11-04
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