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公开(公告)号：US09412689B2
公开(公告)日：2016-08-09
申请号：US13357379
申请日：2012-01-24
申请人： Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
发明人： Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
IPC分类号： H01L23/02 , H01L23/498 , H01L25/10 , H01L23/00
CPC分类号： H01L25/0657 , H01L21/0273 , H01L21/486 , H01L21/56 , H01L21/76898 , H01L23/3128 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/0231 , H01L2224/0239 , H01L2224/03452 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/1131 , H01L2224/11424 , H01L2224/1152 , H01L2224/1162 , H01L2224/11825 , H01L2224/11849 , H01L2224/13024 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13611 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01048 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/12042 , H01L2924/15311 , H01L2924/15321 , H01L2924/15747 , H01L2924/18161 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/00014 , H01L2924/00
摘要： A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.
摘要翻译： 提供一种用于封装半导体管芯的系统和方法。 实施例包括具有第一触点和第二触点的第一封装。 在第一接触件上形成接触后材料，以便调节接触垫之间的接头的高度，导体凸块。 在另一个实施例中，使用导电柱来控制接触垫和外部连接之间的接头的高度。
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公开(公告)号：US08878352B2
公开(公告)日：2014-11-04
申请号：US13357379
申请日：2012-01-24
申请人： Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
发明人： Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
IPC分类号： H01L23/02
摘要： A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.
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公开(公告)号：US20130187268A1
公开(公告)日：2013-07-25
申请号：US13357379
申请日：2012-01-24
申请人： Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
发明人： Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L25/0657 , H01L21/0273 , H01L21/486 , H01L21/56 , H01L21/76898 , H01L23/3128 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/0231 , H01L2224/0239 , H01L2224/03452 , H01L2224/0401 , H01L2224/05083 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/1131 , H01L2224/11424 , H01L2224/1152 , H01L2224/1162 , H01L2224/11825 , H01L2224/11849 , H01L2224/13024 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13611 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01048 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/12042 , H01L2924/15311 , H01L2924/15321 , H01L2924/15747 , H01L2924/18161 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/00014 , H01L2924/00
摘要： A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.
摘要翻译： 提供一种用于封装半导体管芯的系统和方法。 实施例包括具有第一触点和第二触点的第一封装。 在第一接触件上形成接触后材料，以便调节接触垫之间的接头的高度，导体凸块。 在另一个实施例中，使用导电柱来控制接触垫和外部连接之间的接头的高度。
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公开(公告)号：US08809117B2
公开(公告)日：2014-08-19
申请号：US13270890
申请日：2011-10-11
申请人： Wen-Hsiung Lu , Ming-Da Cheng , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Chung-Shi Liu
发明人： Wen-Hsiung Lu , Ming-Da Cheng , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Chung-Shi Liu
IPC分类号： H01L21/00
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/563 , H01L23/3128 , H01L23/562 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L2221/68372 , H01L2224/0401 , H01L2224/05027 , H01L2224/05124 , H01L2224/05554 , H01L2224/05572 , H01L2224/05599 , H01L2224/11444 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/14135 , H01L2224/16225 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75754 , H01L2224/7698 , H01L2224/81001 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/81907 , H01L2224/83102 , H01L2224/9205 , H01L2224/92125 , H01L2224/95001 , H01L2224/97 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/3511 , H01L2924/3512 , H01L2924/3841 , Y10T29/41 , H01L2924/00 , H01L2224/81 , H01L2924/00012 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2224/05552 , H01L2924/013
摘要： Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.
摘要翻译： 公开了用于半导体器件的封装处理工具和封装方法。 在一个实施例中，用于半导体器件的封装处理工具包括包括框架的机械结构。 框架包括适于将多个集成电路管芯保持在其中的多个孔。 框架包括至少一个中空区域。
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5.发明申请Packaging Process Tools and Systems, and Packaging Methods for Semiconductor Devices 有权包装工艺和系统以及半导体器件的封装方法公开(公告)号：US20130143361A1
公开(公告)日：2013-06-06
申请号：US13309311
申请日：2011-12-01
申请人： Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/563 , H01L23/3128 , H01L23/562 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L2221/68372 , H01L2224/0401 , H01L2224/05027 , H01L2224/05124 , H01L2224/05554 , H01L2224/05572 , H01L2224/05599 , H01L2224/11444 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/14135 , H01L2224/16225 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75754 , H01L2224/7698 , H01L2224/81001 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/81907 , H01L2224/83102 , H01L2224/9205 , H01L2224/92125 , H01L2224/95001 , H01L2224/97 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/3511 , H01L2924/3512 , H01L2924/3841 , Y10T29/41 , H01L2924/00 , H01L2224/81 , H01L2924/00012 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2224/05552 , H01L2924/013
摘要： Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.
摘要翻译： 公开了用于半导体器件的封装加工工具和系统以及封装方法。 在一个实施例中，用于半导体器件的封装处理工具包括用于在集成电路管芯的封装工艺期间支撑封装衬底或集成电路管芯的机械结构。 机械结构包括设置在其上的低热导率材料。
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公开(公告)号：US20130062761A1
公开(公告)日：2013-03-14
申请号：US13228768
申请日：2011-09-09
申请人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
发明人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L25/0657 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2221/68331 , H01L2221/68345 , H01L2221/68377 , H01L2224/0231 , H01L2224/0401 , H01L2224/04105 , H01L2224/06515 , H01L2224/09181 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/73259 , H01L2224/81005 , H01L2224/81191 , H01L2224/81815 , H01L2224/9202 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06548 , H01L2924/14 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15322 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2224/81 , H01L2224/03 , H01L2924/014 , H01L2924/00
摘要： Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.
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7.发明授权Packaging process tools and systems, and packaging methods for semiconductor devices 有权包装工艺和系统以及半导体器件的封装方法公开(公告)号：US09543185B2
公开(公告)日：2017-01-10
申请号：US13309311
申请日：2011-12-01
申请人： Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： B23Q3/00 , H01L21/683 , H01L23/31 , H01L23/00 , H01L21/56
CPC分类号： H01L21/6835 , H01L21/561 , H01L21/563 , H01L23/3128 , H01L23/562 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L2221/68372 , H01L2224/0401 , H01L2224/05027 , H01L2224/05124 , H01L2224/05554 , H01L2224/05572 , H01L2224/05599 , H01L2224/11444 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/14135 , H01L2224/16225 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75754 , H01L2224/7698 , H01L2224/81001 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/81907 , H01L2224/83102 , H01L2224/9205 , H01L2224/92125 , H01L2224/95001 , H01L2224/97 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/3511 , H01L2924/3512 , H01L2924/3841 , Y10T29/41 , H01L2924/00 , H01L2224/81 , H01L2924/00012 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2224/05552 , H01L2924/013
摘要： Packaging process tools and systems, and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure for supporting package substrates or integrated circuit die during a packaging process for the integrated circuit die. The mechanical structure includes a low thermal conductivity material disposed thereon.
摘要翻译： 公开了用于半导体器件的封装加工工具和系统以及封装方法。 在一个实施例中，用于半导体器件的封装处理工具包括用于在集成电路管芯的封装工艺期间支撑封装衬底或集成电路管芯的机械结构。 机械结构包括设置在其上的低热导率材料。
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公开(公告)号：US08609462B2
公开(公告)日：2013-12-17
申请号：US13272032
申请日：2011-10-12
申请人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L21/44
CPC分类号： B23Q3/18 , H01L21/50 , H01L21/561 , H01L21/563 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75733 , H01L2224/75744 , H01L2224/75754 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2224/83104 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/97 , H01L2924/3511 , Y10T29/41 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2924/00012 , H01L2924/014
摘要： A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.
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公开(公告)号：US08884431B2
公开(公告)日：2014-11-11
申请号：US13228768
申请日：2011-09-09
申请人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
发明人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L21/683 , H01L23/498 , H01L21/56 , H01L25/065 , H01L23/538 , H01L25/00 , H01L23/00 , H01L23/31 , H01L25/10 , H01L25/03 , H01L21/768
CPC分类号： H01L25/0657 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2221/68331 , H01L2221/68345 , H01L2221/68377 , H01L2224/0231 , H01L2224/0401 , H01L2224/04105 , H01L2224/06515 , H01L2224/09181 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/73259 , H01L2224/81005 , H01L2224/81191 , H01L2224/81815 , H01L2224/9202 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06548 , H01L2924/14 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15322 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2224/81 , H01L2224/03 , H01L2924/014 , H01L2924/00
摘要： Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.
摘要翻译： 公开了用于半导体器件的封装方法和结构。 在一个实施例中，封装的半导体器件包括具有第一表面和与第一表面相对的第二表面的再分配层（RDL）。 至少一个集成电路耦合到RDL的第一表面，并且多个金属凸块耦合到RDL的第二表面。 模制化合物设置在RDL的至少一个集成电路和第一表面上。
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公开(公告)号：US20130095608A1
公开(公告)日：2013-04-18
申请号：US13272032
申请日：2011-10-12
申请人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： B23Q3/18 , H01L21/50 , H01L21/561 , H01L21/563 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75733 , H01L2224/75744 , H01L2224/75754 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2224/83104 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/97 , H01L2924/3511 , Y10T29/41 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2924/00012 , H01L2924/014
摘要： A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.
摘要翻译： 一种方法包括在第一包装部件和第二包装部件之间分配底部填充物，其中第一包装部件被放置在下部夹具上，并且第二包装部件结合到第一包装部件上。 通孔位于下夹具中并在第一包装部件下方。 底部填充物被固化，其中在固化底部填充物的步骤期间，施加力以使第一包装部件变平。 通过执行从通过通孔的抽真空和空气吹扫的组中选择的动作来施加力。
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