Invention Grant
- Patent Title: MOSFET with source side only stress
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Application No.: US14559451Application Date: 2014-12-03
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Publication No.: US09412869B2Publication Date: 2016-08-09
- Inventor: Samuel Zafar Nawaz , Shaofeng Yu , Jeffrey E. Brighton , Song Zhao
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Frank D. Cimino
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/165

Abstract:
An integrated circuit contains a transistor with a stress enhancement region on the source side only. In a DeMOS transistor, forming the stress enhancement region on the source side only and not forming a stress enhancement region in the drain extension increases the resistance of the drain extension region enabling formation of a DeMOS transistor with reduced area. In a MOS transistor, by forming the stress enhancement region on the source side only and eliminating the stress enhancement region from the drain side, transistor leakage is reduced and CHC reliability improved.
Public/Granted literature
- US20150087127A1 MOSFET WITH SOURCE SIDE ONLY STRESS Public/Granted day:2015-03-26
Information query
IPC分类: