Invention Grant
- Patent Title: Method of controlling contact hole profile for metal fill-in
- Patent Title (中): 控制金属填充接触孔剖面的方法
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Application No.: US14138007Application Date: 2013-12-21
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Publication No.: US09425086B2Publication Date: 2016-08-23
- Inventor: Fang-Hao Hsu , Hsu-Sheng Yu , Kuo-Feng Lo , Hong-Ji Lee
- Applicant: Macronix International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Fish & Richardson P.C.
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/485 ; H01L23/31 ; H01L23/532

Abstract:
A method of eliminating overhang in a contact hole formed in a contact film stack is described. A liner layer is overlaid on the contact film stack, the liner also coating the contact hole. A portion of the liner is removed to expose the overhang, and the exposed overhang is removed. The liner is also used to fill-in a bowing profile of the contact hole, thereby rendering sidewalls of the contact hole smooth and straight suitable for metal fill-in while suppressing piping defects.
Public/Granted literature
- US20150179569A1 METHOD OF CONTROLLING CONTACT HOLE PROFILE FOR METAL FILL-IN Public/Granted day:2015-06-25
Information query
IPC分类: