Invention Grant
US09425151B2 Compliant electrostatic transfer head with spring support layer 有权
符合静电转印头带弹簧支撑层

Compliant electrostatic transfer head with spring support layer
Abstract:
A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.
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