Compliant electrostatic transfer head with spring support layer
    1.
    发明授权
    Compliant electrostatic transfer head with spring support layer 有权
    符合静电转印头带弹簧支撑层

    公开(公告)号:US09425151B2

    公开(公告)日:2016-08-23

    申请号:US14307325

    申请日:2014-06-17

    Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.

    Abstract translation: 描述了柔性静电转印头和形成顺应性静电转印头的方法。 在一个实施例中,顺应性静电转印头包括基底衬底中的空腔,在基底衬底上的弹簧支撑层,以及弹簧支撑层上的图案化器件层。 弹簧支撑层包括弹簧支撑层梁轮廓,该弹性支撑层梁型材向空腔延伸并且可偏转,并且图案化的装置层包括由弹簧支撑层梁轮廓支撑并且朝向腔体可偏转的电极梁轮廓 。

    COMPLIANT ELECTROSTATIC TRANSFER HEAD WITH DEFINED CAVITY
    2.
    发明申请
    COMPLIANT ELECTROSTATIC TRANSFER HEAD WITH DEFINED CAVITY 有权
    具有定义孔的合适静电转印头

    公开(公告)号:US20160094160A1

    公开(公告)日:2016-03-31

    申请号:US14502994

    申请日:2014-09-30

    CPC classification number: B81C99/002 H01H59/0009 H01L41/113

    Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.

    Abstract translation: 描述了柔性静电转印头和形成顺应性静电转印头的方法。 在一个实施例中,顺应性静电转印头包括基底衬底,在基底衬底上的空腔模板层,在基底衬底和腔模板层之间的第一限制层,以及腔模板层上的图案化器件层。 图案化器件层包括能够朝向空腔模板层中的空腔偏转的电极。 在一个实施例中,第二限制层位于空腔模板层和图案化器件层之间。

    COMPLIANT ELECTROSTATIC TRANSFER HEAD WITH SPRING SUPPORT LAYER
    3.
    发明申请
    COMPLIANT ELECTROSTATIC TRANSFER HEAD WITH SPRING SUPPORT LAYER 有权
    具有弹簧支撑层的合适的静电转印头

    公开(公告)号:US20150364424A1

    公开(公告)日:2015-12-17

    申请号:US14307325

    申请日:2014-06-17

    Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.

    Abstract translation: 描述了柔性静电转印头和形成顺应性静电转印头的方法。 在一个实施例中,顺应性静电转印头包括基底衬底中的空腔,在基底衬底上的弹簧支撑层,以及弹簧支撑层上的图案化器件层。 弹簧支撑层包括弹簧支撑层梁轮廓,该弹性支撑层梁型材向空腔延伸并且可偏转,并且图案化的装置层包括由弹簧支撑层梁轮廓支撑并且朝向腔体可偏转的电极梁轮廓 。

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