Invention Grant
- Patent Title: Strain inducing semiconductor regions
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Application No.: US14133457Application Date: 2013-12-18
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Publication No.: US09425256B2Publication Date: 2016-08-23
- Inventor: Suman Datta , Jack T. Kavalieros , Been-Yih Jin
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal, LLP
- Main IPC: H01L29/12
- IPC: H01L29/12 ; H01L29/10 ; H01L29/201 ; H01L29/205 ; H01L29/78 ; H01L29/417 ; H01L29/775 ; H01L29/06 ; H01L29/66

Abstract:
A method to form a strain-inducing semiconductor region is described. In one embodiment, formation of a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In another embodiment, a semiconductor region with a crystalline lattice of one or more species of charge-neutral lattice-forming atoms imparts a strain to a crystalline substrate, wherein the lattice constant of the semiconductor region is different from that of the crystalline substrate, and wherein all species of charge-neutral lattice-forming atoms of the semiconductor region are contained in the crystalline substrate.
Public/Granted literature
- US20140103396A1 STRAIN-INDUCING SEMICONDUCTOR REGIONS Public/Granted day:2014-04-17
Information query
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