Invention Grant
US09431317B2 Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package
有权
功率倍增器放大器模块，其具有在散热器和电路封装的散热焊盘之间的焊接覆盖率的改善
- Patent Title: Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package
- Patent Title (中): 功率倍增器放大器模块，其具有在散热器和电路封装的散热焊盘之间的焊接覆盖率的改善
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Application No.: US14074057Application Date: 2013-11-07
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Publication No.: US09431317B2Publication Date: 2016-08-30
- Inventor: Yongguo Chen , Hujiao Wang , David A. Holtzclaw , Wei Qi , Benjamin Lee Davis , John MacKay
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agent Leon R. Turkevich; Edward J. Stemberger
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/367 ; H01L23/13 ; H01L23/40 ; H01L23/42
Abstract:
In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface that contacts and thermally couples with the thermal pad. The wall includes at least one aperture there-through. Solder paste is provided between the contact surface and the thermal pad to bond the contact surface to the thermal pad, with the at least one aperture being constructed and arranged to aid in outgassing of the solder paste.
Public/Granted literature
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