Invention Grant
- Patent Title: Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure
- Patent Title (中): 估计三维一体化结构内金属物质扩散长度的方法及相应的三维一体化结构
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Application No.: US14572288Application Date: 2014-12-16
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Publication No.: US09431373B2Publication Date: 2016-08-30
- Inventor: Rachid Taibi , Cédrick Chappaz , Lea Di Cioccio , Laurent-Luc Chapelon
- Applicant: STMicroelectronics SA , STMicroelectronics (Crolles 2) SAS
- Applicant Address: FR Montrouge FR Crolles
- Assignee: STMICROELECTRONICS SA,STMICROELECTRONICS (CROLLES 2) SAS
- Current Assignee: STMICROELECTRONICS SA,STMICROELECTRONICS (CROLLES 2) SAS
- Current Assignee Address: FR Montrouge FR Crolles
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: FR1158501 20110923
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L25/065 ; H01L27/06
Abstract:
A three-dimensional integrated structure may include two assembled integrated circuits respectively including two metallic lines, and at least two cavities passing through one of the integrated circuits and opening onto two locations respectively in electrical contact with the two metallic lines. The cavities may be sized to place a measuring apparatus at the bottom of the cavities, and in electrical contact with the two locations.
Public/Granted literature
Information query
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