公开(公告)号：US09431373B2

公开(公告)日：2016-08-30

申请号：US14572288

申请日：2014-12-16

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS

Inventor： Rachid Taibi ,  Cédrick Chappaz ,  Lea Di Cioccio ,  Laurent-Luc Chapelon

IPC: H01L21/66 ,  H01L25/065 ,  H01L27/06

CPC classification number: H01L25/0657 ,  H01L22/12 ,  H01L22/14 ,  H01L27/0688 ,  H01L2224/48463 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06596

Abstract: A three-dimensional integrated structure may include two assembled integrated circuits respectively including two metallic lines, and at least two cavities passing through one of the integrated circuits and opening onto two locations respectively in electrical contact with the two metallic lines. The cavities may be sized to place a measuring apparatus at the bottom of the cavities, and in electrical contact with the two locations.

Abstract translation: 三维集成结构可以包括分别包括两条金属线的两个组装的集成电路，以及穿过集成电路中的一个的至少两个空腔，并分别与两个金属线电接触地分开开放到两个位置。 空腔的尺寸可以将测量装置放置在空腔的底部，并与两个位置电接触。

公开(公告)号：US10532379B2

公开(公告)日：2020-01-14

申请号：US15515856

申请日：2015-09-30

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ,  STMicroelectronics (Crolles 2) SAS ,  UNIVERSITE GRENOBLE ALPES

Inventor： Fabrice Casset ,  Skandar Basrour ,  Cédrick Chappaz ,  Jean-Sébastien Danel

IPC: H01L41/09 ,  B06B3/00 ,  B81B3/00 ,  B06B1/04 ,  B06B1/06 ,  H01L41/18 ,  H01L41/25

Abstract: A mechanical structure comprising a stack including an active substrate and at least one actuator designed to generate vibrations at the active substrate, the stack comprises an elementary structure for amplifying the vibrations: positioned between the actuator and the active substrate, the structure designed to transmit and amplify the vibrations; and comprising at least one trench, located between the actuator and the active substrate. A method for manufacturing the structure comprising the use of a temporary substrate is provided.