Invention Grant
US09432759B2 Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals
有权
表面安装麦克风封装，麦克风布置，移动电话和用于记录麦克风信号的方法
- Patent Title: Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals
- Patent Title (中): 表面安装麦克风封装，麦克风布置，移动电话和用于记录麦克风信号的方法
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Application No.: US14065067Application Date: 2013-10-28
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Publication No.: US09432759B2Publication Date: 2016-08-30
- Inventor: Klaus Elian , Horst Theuss , Thomas Mueller
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H04R1/08
- IPC: H04R1/08 ; B81B7/00 ; H04R19/00
Abstract:
A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
Public/Granted literature
Information query
