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    Photoacoustic gas sensor package
    3.
    发明授权
    Photoacoustic gas sensor package 有权

    公开(公告)号：US10782270B2

    公开(公告)日：2020-09-22

    申请号：US16036484

    申请日：2018-07-16

    Applicant: Infineon Technologies AG

    Inventor： Horst Theuss ,  Rainer Markus Schaller ,  Thomas Mueller

    IPC: G01J5/02 ,  G01N29/24 ,  G01N21/17 ,  G01N29/30 ,  G01N29/032

    Abstract: A photoacoustic sensor device may include a housing and first and second ceramic cavity packages disposed in the housing. The first ceramic cavity package may include a first sidewall having a first set of electrical contact elements, a first cavity structure, and a light source electrically coupled to the first set of electrical contact elements. The second ceramic cavity package may include a second sidewall having a second set of electrical contact elements, a second cavity structure, and a photoacoustic detector electrically coupled to the second set of electrical contact elements. The first and second ceramic cavity packages may be arranged such that the light source and the photoacoustic detector face one another, and oriented such that the first and second sets of electrical contact elements align with electrical contact points of a PCB when the photoacoustic sensor device is positioned over the PCB for coupling to the PCB.

    APPARATUS FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A BATTERY, A RECHARGEABLE BATTERY OR A BATTERY, AND A METHOD FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A BATTERY
    7.
    发明申请
    APPARATUS FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A BATTERY, A RECHARGEABLE BATTERY OR A BATTERY, AND A METHOD FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A BATTERY 有权
    用于确定可充电电池状态或电池，可充电电池或电池的装置，以及用于确定可充电电池状态或电池状态的方法

    公开(公告)号：US20150004451A1

    公开(公告)日：2015-01-01

    申请号：US14311489

    申请日：2014-06-23

    Applicant: Infineon Technologies AG

    Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Manfred Fries ,  Juergen Hoegerl ,  Georg Meyer-Berg ,  Thomas Mueller ,  Guenther Ruhl ,  Horst Theuss ,  Mathias Vaupel

    IPC: G01R31/36 ,  H01M10/48

    CPC classification number: H01M10/48 ,  G01R31/3689 ,  H01M6/505 ,  H01M10/488

    Abstract: An apparatus for determining a state of a rechargeable battery or of a battery has a sensor device and an evaluation device. The sensor device brings about an interaction between an optical signal and a part of the rechargeable battery or of the battery, which part indicates optically acquirable information about a state of the rechargeable battery or of the battery, and detects an optical signal caused by the interaction. The sensor device furthermore provides a detection signal having information about the detected optical signal. The evaluation device determines information about a state of the rechargeable battery or of the battery on the basis of the information of the detection signal. Furthermore, the evaluation device provides a state signal having the information about the determined state.

    Abstract translation: 用于确定可再充电电池或电池的状态的装置具有传感器装置和评估装置。 该传感器装置引起光信号与可再充电电池或电池的一部分之间的相互作用，该部分指示关于可再充电电池或电池的状态的光学上可获取的信息，并检测由相互作用引起的光信号 。 传感器装置还提供具有关于检测到的光信号的信息的检测信号。 评估装置基于检测信号的信息来确定关于可再充电电池或电池的状态的信息。 此外，评估装置提供具有关于所确定的状态的信息的状态信号。

    Inductive angle and/or position sensor
    8.
    发明授权
    Inductive angle and/or position sensor 有权

    公开(公告)号：US11619520B2

    公开(公告)日：2023-04-04

    申请号：US17247665

    申请日：2020-12-18

    Applicant: Infineon Technologies AG

    Inventor： Udo Ausserlechner ,  Horst Theuss ,  Thomas Mueller

    IPC: G01D5/20

    Abstract: The present disclosure relates to an inductive angle and/or position sensor comprising a first sensor component and a second sensor component, which is movable relative thereto, wherein the first sensor component comprises an excitation coil and a receiving coil arrangement having two or more individual receiving coils, and wherein the second sensor component comprises an inductive target. The first sensor component comprises a semiconductor chip having an integrated circuit. The sensor comprises a housing, in which the semiconductor chip is arranged. The individual receiving coils of the receiving coil arrangement are configured in at least two structured metallization layers spaced apart from one another, which are arranged within the housing and/or outside on an outer surface of the housing.

    MOLDED SEMICONDUCTOR PACKAGE HAVING ENHANCED LOCAL ADHESION CHARACTERISTICS
    10.
    发明申请
    MOLDED SEMICONDUCTOR PACKAGE HAVING ENHANCED LOCAL ADHESION CHARACTERISTICS 审中-公开
    具有增强的本地粘合特性的模制半导体封装

    公开(公告)号：US20160282212A1

    公开(公告)日：2016-09-29

    申请号：US14667858

    申请日：2015-03-25

    Applicant: Infineon Technologies AG

    Inventor： Sebastian Beer ,  Helmut Wietschorke ,  Jochen Dangelmaier ,  Horst Theuss ,  Bernhard Knott ,  Thomas Mueller ,  Andreas Allmeier

    IPC: G01L19/14 ,  H01L25/18 ,  H01L21/52 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

    CPC classification number: G01L19/147 ,  G01L19/0084 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49586 ,  H01L25/18 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012

    Abstract: A molded semiconductor package includes a substrate having opposing first and second main surfaces, a semiconductor die attached to the first main surface of the substrate, an adhesion adapter attached to the second main surface of the substrate or a surface of the semiconductor die facing away from the substrate, and a mold compound encapsulating the semiconductor die, the adhesion adapter and at least part of the substrate. The adhesion adapter is configured to adapt adhesion properties of the mold compound to adhesion properties of the substrate or semiconductor die to which the adhesion adapter is attached, such that the mold compound more strongly adheres to the adhesion adapter than directly to the substrate or semiconductor die to which the adhesion adapter is attached. The adhesion adapter has a surface feature which strengthens the adhesion between the adhesion adapter and the mold compound.

    Abstract translation: 模制的半导体封装包括具有相对的第一和第二主表面的基板，附接到基板的第一主表面的半导体管芯，附接到基板的第二主表面的粘合适配器或半导体管芯的远离 衬底和封装半导体管芯，粘合适配器和至少部分衬底的模具化合物。 粘合适配器被配置成使得模制化合物的粘合性能适应于粘合适配器所附着的基底或半导体管芯的粘合性能，使得模制化合物比直接连接到基底或半导体模具更强烈地粘附到粘合适配器 附着适配器附接到该装置。 粘合适配器具有加强粘合适配器和模具化合物之间的粘附的表面特征。

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