Invention Grant
- Patent Title: Conductive connections, structures with such connections, and methods of manufacture
- Patent Title (中): 导电连接，具有这种连接的结构以及制造方法
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Application No.: US14275514Application Date: 2014-05-12
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Publication No.: US09437566B2Publication Date: 2016-09-06
- Inventor: Rajesh Katkar , Cyprian Emeka Uzoh
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00 ; H05K3/34 ; H05K1/11 ; H05K1/14 ; B23K26/32 ; B23K3/06 ; B23K35/02 ; H01L23/31 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L25/065 ; H01L25/10 ; H01L25/00 ; H01L21/02 ; B23K1/00
Abstract:
In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball's surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball (140i). A solder connection may be surrounded by a solder locking layer (1210) and may be recessed in a hole (1230) in that layer. Other features are also provided.
Public/Granted literature
- US20150325543A1 CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE Public/Granted day:2015-11-12
Information query
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