Invention Grant
- Patent Title: LED module
- Patent Title (中): LED模块
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Application No.: US14404092Application Date: 2013-05-24
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Publication No.: US09437581B2Publication Date: 2016-09-06
- Inventor: Yoji Urano , Akifumi Nakamura , Hayato Ioka , Ryoji Imai , Jun Goda , Toru Hirano , Masanori Suzuki , Hideaki Hyuga
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2012-125017 20120531
- International Application: PCT/JP2013/003303 WO 20130524
- International Announcement: WO2013/179626 WO 20131205
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L25/075 ; H01L33/48 ; H01L33/50 ; H01L33/60 ; H01L33/54 ; H01L33/62 ; F21K99/00 ; F21S8/02 ; F21Y101/02

Abstract:
The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.
Public/Granted literature
- US20150108510A1 LED MODULE Public/Granted day:2015-04-23
Information query
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