- 专利标题: Thermally driven workload scheduling in a heterogeneous multi-processor system on a chip
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申请号: US14195976申请日: 2014-03-04
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公开(公告)号: US09442774B2公开(公告)日: 2016-09-13
- 发明人: Sumit Sur , James M. Artmeier , Mark D. Guzzi , Philip T. Mueller, Jr. , Bohuslav Rychlik
- 申请人: QUALCOMM INCORPORATED
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 代理商 Nicholas A. Cole
- 主分类号: G06F9/46
- IPC分类号: G06F9/46 ; G06F9/455 ; G06F9/50 ; G06F1/20 ; G06F1/32 ; G06F11/30 ; G06F11/34
摘要:
Various embodiments of methods and systems for thermally aware scheduling of workloads in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, and because more than one of the processing components may be capable of processing a given block of code, thermally aware workload scheduling techniques that compare performance curves of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by allocating workloads in real time, or near real time, to the processing components best positioned to efficiently process the block of code.
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