Invention Grant
- Patent Title: Multi-step system and method for curing a dielectric film
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Application No.: US14877136Application Date: 2015-10-07
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Publication No.: US09443725B2Publication Date: 2016-09-13
- Inventor: Junjun Liu , Eric M. Lee , Dorel I. Toma
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Minato-ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P
- Main IPC: H01L21/42
- IPC: H01L21/42 ; H01L21/02 ; H01L21/67 ; B05D3/06
Abstract:
A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such as moisture, in the dielectric film. The system further includes a curing system coupled to the drying system, and configured to treat the dielectric film with ultraviolet (UV) radiation and infrared (IR) radiation in order to cure the dielectric film.
Public/Granted literature
- US20160027641A1 MULTI-STEP SYSTEM AND METHOD FOR CURING A DIELECTRIC FILM Public/Granted day:2016-01-28
Information query
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