Invention Grant
- Patent Title: Arrangement apparatus and arrangement method
- Patent Title (中): 布置装置和布置方法
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Application No.: US14488356Application Date: 2014-09-17
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Publication No.: US09444315B2Publication Date: 2016-09-13
- Inventor: Satoru Saito , Yutaka Matsumoto , Daisuke Ueno
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2013-193299 20130918
- Main IPC: H02K15/04
- IPC: H02K15/04 ; H02K15/085 ; H02K15/00

Abstract:
An arrangement apparatus and an arrangement method of allowing gripping devices to grip electrical conductors by using inexpensive, simple, and small-sized configurations. A stator manufacturing apparatus for arranging coil elements in a ring shape includes: a plurality of gripping devices that are arranged in a ring shape and grip coil elements; robot arms that supply the coil elements to the gripping devices; and a turntable that integrally rotates the plurality of gripping devices. According to this, the gripping devices are rotated by the turntable is aligned in a ring shape, and thus, the coil elements are supplied to the arrangement points by the robot arms and the plurality of coil elements can be aligned in a ring shape while gripped by the gripping devices.
Public/Granted literature
- US20150078875A1 ARRANGEMENT APPARATUS AND ARRANGEMENT METHOD Public/Granted day:2015-03-19
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