Invention Grant
US09449943B2 Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
有权
半导体器件和平板印刷电路板单元的表面与虚拟铜图案的平衡方法
- Patent Title: Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
- Patent Title (中): 半导体器件和平板印刷电路板单元的表面与虚拟铜图案的平衡方法
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Application No.: US14329464Application Date: 2014-07-11
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Publication No.: US09449943B2Publication Date: 2016-09-20
- Inventor: Yaojian Lin , Kang Chen , Hin Hwa Goh , Ii Kwon Shim
- Applicant: STATS ChipPAC, Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Patent Law Group: Atkins and Associates, P.C.
- Agent Robert D. Atkins
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L23/31 ; H01L23/13 ; H01L23/498 ; H01L21/56
Abstract:
A semiconductor device has a substrate. A conductive via is formed through the substrate. A plurality of first contact pads is formed over a first surface of the substrate. A plurality of second contact pads is formed over a second surface of the substrate. A dummy pattern is formed over the second surface of the substrate. An indentation is formed in a sidewall of the substrate. An opening is formed through the substrate. An encapsulant is deposited in the opening. An insulating layer is formed over second surface of the substrate. A dummy opening is formed in the insulating layer. A semiconductor die is disposed adjacent to the substrate. An encapsulant is deposited over the semiconductor die and substrate. The first surface of the substrate includes a width that is greater than a width of the second surface of the substrate.
Public/Granted literature
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