- 专利标题： Electronic package structure
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申请号： US14594083申请日： 2015-01-10
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公开(公告)号： US09451701B2公开(公告)日： 2016-09-20
- 发明人: Da-Jung Chen , Chun-Tiao Liu , Bau-Ru Lu
- 申请人： CYNTEC CO., LTD.
- 申请人地址： TW Hsinchu
- 专利权人： CYNTEC Co., Ltd.
- 当前专利权人： CYNTEC Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Litron Patent and Trademark Office
- 代理商 Min-Lee Teng
- 优先权： TW97105555A 20080218
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; H05K1/18 ; H01L23/64 ; H01L25/16 ; H01F27/24 ; H01F27/29 ; H01F27/40 ; H01F27/02 ; H05K3/34 ; H01L23/24 ; H01L23/31 ; H01L23/552 ; H01L23/00
摘要：
The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
公开/授权文献
- US20150116973A1 ELECTRONIC PACKAGE STRUCTURE 公开/授权日：2015-04-30
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