Invention Grant
- Patent Title: Method for manufacturing a micromechanical system comprising a removal of sacrificial material through a hole in a margin region
- Patent Title (中): 用于制造微机械系统的方法,包括通过边缘区域中的孔去除牺牲材料
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Application No.: US13722248Application Date: 2012-12-20
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Publication No.: US09452923B2Publication Date: 2016-09-27
- Inventor: Thoralf Kautzsch , Heiko Froehlich , Mirko Vogt , Maik Stegemann
- Applicant: Infineon Technologies Dresden GmbH
- Applicant Address: DE Dresden
- Assignee: INFINEON TECHNOLOGIES DRESDEN GMBH
- Current Assignee: INFINEON TECHNOLOGIES DRESDEN GMBH
- Current Assignee Address: DE Dresden
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L41/00
- IPC: H01L41/00 ; B81C1/00 ; H01L41/09

Abstract:
A method for manufacturing a micromechanical system includes creating a sacrificial layer at a substrate surface. A structural material is deposited at a sacrificial layer surface and at a support structure for later supporting the structural material. At least one hole is created in the structural material extending from an exposed surface of the structural material to the surface of the sacrificial layer. The at least one hole leads to a margin region of the sacrificial layer. The sacrificial layer is removed using a removal process through the at least one hole, to obtain a cavity between the surface of the substrate and the structural material. The method also includes filling the at least one hole and a portion of the cavity beneath the at least one hole close to the cavity. A corresponding micromechanical system and a microelectromechanical transducer are also described.
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