Invention Grant
US09455383B2 Molded package for light emitting device and light emitting device using the same
有权
用于发光装置的模制包装和使用其的发光装置
- Patent Title: Molded package for light emitting device and light emitting device using the same
- Patent Title (中): 用于发光装置的模制包装和使用其的发光装置
-
Application No.: US13932096Application Date: 2013-07-01
-
Publication No.: US09455383B2Publication Date: 2016-09-27
- Inventor: Kunihito Sugimoto , Keisuke Sejiki
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi, Tokushima
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi, Tokushima
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2012-150428 20120704; JPP2013-132958 20130625
- Main IPC: H01L33/64
- IPC: H01L33/64 ; H01L33/54 ; H01L33/62 ; H01L21/56 ; H01L33/48
Abstract:
A molded package, comprising: a molded resin having a recess for accommodating a light emitting element; a ceramic substrate disposed in a bottom of the recess, the ceramic substrate having one surface exposed from the bottom of the recess and the other surface exposed from a rear surface of the molded resin; and a lead disposed at a lower part of the molded resin, the light emitting element being mounted on the one surface of the ceramic substrate, the lead being in contact with at least one side surface of the ceramic substrate to hold the ceramic substrate.
Public/Granted literature
- US20140008692A1 MOLDED PACKAGE FOR LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE USING THE SAME Public/Granted day:2014-01-09
Information query
IPC分类:
