公开(公告)号：US09455383B2

公开(公告)日：2016-09-27

申请号：US13932096

申请日：2013-07-01

Applicant: NICHIA CORPORATION

Inventor： Kunihito Sugimoto ,  Keisuke Sejiki

IPC: H01L33/64 ,  H01L33/54 ,  H01L33/62 ,  H01L21/56 ,  H01L33/48

CPC classification number: H01L33/54 ,  H01L21/565 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/502 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19107

Abstract: A molded package, comprising: a molded resin having a recess for accommodating a light emitting element; a ceramic substrate disposed in a bottom of the recess, the ceramic substrate having one surface exposed from the bottom of the recess and the other surface exposed from a rear surface of the molded resin; and a lead disposed at a lower part of the molded resin, the light emitting element being mounted on the one surface of the ceramic substrate, the lead being in contact with at least one side surface of the ceramic substrate to hold the ceramic substrate.

Abstract translation: 一种模制包装，包括：模制树脂，具有用于容纳发光元件的凹部; 设置在所述凹部的底部的陶瓷基板，所述陶瓷基板具有从所述凹部的底部露出的一个表面，从所述模制树脂的后表面露出的另一个表面; 以及设置在所述模制树脂的下部的引线，所述发光元件安装在所述陶瓷基板的一个表面上，所述引线与所述陶瓷基板的至少一个侧表面接触以保持所述陶瓷基板。

公开(公告)号：US10297728B2

公开(公告)日：2019-05-21

申请号：US14745112

申请日：2015-06-19

Applicant: Nichia Corporation

Inventor： Nobuhide Kasae ,  Keisuke Sejiki

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  F21V21/00 ,  H01L33/52 ,  H01L33/48

Abstract: The present invention provides a molded package for a light emitting device including a molded resin and first and second leads, the exposed surface of the first lead having a first and second edge portions opposed to each other so as to put a mounting area therebetween in a first direction, the first and second edge portions respectively having one first cutout and second cutouts, the mounting area having a size not less than a distance between the first and the second cutouts and less than a distance between the first the second edge portions in the first direction.

公开(公告)号：US09093621B2

公开(公告)日：2015-07-28

申请号：US13728530

申请日：2012-12-27

Applicant: Nichia Corporation

Inventor： Nobuhide Kasae ,  Keisuke Sejiki

IPC: H01L33/00 ,  H01L21/00 ,  H01L33/52 ,  H01L33/62 ,  F21V21/00 ,  H01L33/48

CPC classification number: H01L33/502 ,  F21V21/00 ,  H01L33/486 ,  H01L33/52 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: The present invention provides a molded package for a light emitting device including a molded resin and first and second leads, the exposed surface of the first lead having a first and second edge portions opposed to each other so as to put a mounting area therebetween in a first direction, the first and second edge portions respectively having one first cutout and second cutouts, the mounting area having a size not less than a distance between the first and the second cutouts and less than a distance between the first the second edge portions in the first direction.

Abstract translation: 本发明提供了一种用于发光器件的模制封装，其包括模制树脂和第一和第二引线，所述第一引线的暴露表面具有彼此相对的第一和第二边缘部分，以将其中的安装区域放置在 第一方向，第一边缘部分和第二边缘部分分别具有一个第一切口和第二切口，该安装区域具有不小于第一和第二切口之间的距离的尺寸，并且小于第一边缘部分中的第一边缘部分之间的距离 第一个方向

公开(公告)号：US09496465B2

公开(公告)日：2016-11-15

申请号：US14785027

申请日：2014-03-26

Applicant: NICHIA CORPORATION ,  KOITO MANUFACTURING CO., LTD.

Inventor： Kunihito Sugimoto ,  Keisuke Sejiki ,  Tsukasa Tokida ,  Shinpei Maeda

IPC: H01L29/18 ,  H01L33/50 ,  H01L25/075 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element whose upper surface is a light extraction surface, and a light-transmissive member that has an upper surface and a lower surface, and covers the light extraction surface of the light emitting element. The light-transmissive member contains a phosphor. The upper surface and the lower surface of the light-transmissive member are both flat surfaces and parallel to each other. A side surface of the light-transmissive member has a protruding portion that protrudes to the side and has contact with the lower surface.

Abstract translation: 发光器件包括上表面是光提取表面的发光元件和具有上表面和下表面的透光元件，并且覆盖发光元件的光提取表面。 透光部件含有荧光体。 透光性构件的上表面和下表面均为平坦表面并且彼此平行。 透光部件的侧面具有向侧面突出并与下表面接触的突出部。

公开(公告)号：US20130168723A1

公开(公告)日：2013-07-04

申请号：US13728530

申请日：2012-12-27

Applicant: Nichia Corporation

Inventor： Nobuhide Kasae ,  Keisuke Sejiki

IPC: H01L33/52 ,  F21V21/00

CPC classification number: H01L33/502 ,  F21V21/00 ,  H01L33/486 ,  H01L33/52 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: The present invention provides a molded package for a light emitting device including a molded resin and first and second leads, the exposed surface of the first lead having a first and second edge portions opposed to each other so as to put a mounting area therebetween in a first direction, the first and second edge portions respectively having one first cutout and second cutouts, the mounting area having a size not less than a distance between the first and the second cutouts and less than a distance between the first the second edge portions in the first direction.

公开(公告)号：US09518718B2

公开(公告)日：2016-12-13

申请号：US14140379

申请日：2013-12-24

Applicant: NICHIA CORPORATION

Inventor： Daisuke Sanga ,  Tomonori Morizumi ,  Naoki Azuma ,  Keisuke Sejiki ,  Kunihito Sugimoto

IPC: F21V9/08 ,  H01L25/075 ,  H01L33/58 ,  G02B5/28 ,  H01L33/50

CPC classification number: F21V9/08 ,  G02B5/285 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/58 ,  H01L2224/16225

Abstract: Provided is a bandpass filter for a light emitting device that can improve the light emission efficiency in use for a light emitting device, and a light emitting device that can obtain the high light emission efficiency by using the bandpass filter. The light emitting device includes a substrate; a light emitting element disposed over the substrate; a phosphor-containing layer containing at least one kind of phosphor; and a bandpass filter disposed over a surface of the phosphor-containing layer on the light emitting element side, the bandpass filter including a multilayer film having a plurality of first and second dielectric layers, the second dielectric layer being disposed over the first dielectric layer. The bandpass filter has a transmittance of 60% or more for light having a light emission peak wavelength of the light emitting element at an incident angle of 0 to 85°, and another transmittance of 40% or less for light having a light emission peak wavelength of at least one kind of phosphor at an incident angle of a Brewster's angle (θb)+5° (θb+5°) to 85° of the bandpass filter.

Abstract translation: 提供一种能够提高发光装置的发光效率的发光装置的带通滤光器，以及能够通过使用带通滤波器而获得高的发光效率的发光装置。 发光装置包括：基板; 设置在所述基板上的发光元件; 含有至少一种荧光体的含磷光体层; 以及设置在所述发光元件侧的所述含荧光体层的表面上的带通滤波器，所述带通滤波器包括具有多个第一和第二电介质层的多层膜，所述第二介电层设置在所述第一介电层上。 对于具有0〜85°的入射角的发光元件的发光峰值波长的光，对于具有发光峰值波长的光，带通滤波器的透射率为60％以上，另外透射率为40％以下 的至少一种荧光体，其入射角为带通滤波器的布鲁斯特角（θb）+ 5°（θb+ 5°）至85°。

公开(公告)号：US09048405B2

公开(公告)日：2015-06-02

申请号：US14133920

申请日：2013-12-19

Applicant: Nichia Corporation

Inventor： Daisuke Sanga ,  Takuya Okada ,  Keisuke Sejiki ,  Kunihito Sugimoto ,  Takao Kosugi ,  Dai Wakamatsu

IPC: H01L33/60 ,  H01L33/50 ,  H01L25/075 ,  H01L33/44

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/505 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The light emitting device comprising a light emitting element; and a wavelength converting member having a first face and a second face, in which light emitted from the light emitting element enters in through the first face, and a part of the second face serves as a light emitting face, wherein the light emitting element further comprises a reflection control structure around the light emitting face of the second face, and the reflection control structure comprises a reflection film on the wavelength converting member and an anti-reflection film on the reflection film.

Abstract translation: 发光器件包括发光元件; 以及具有第一面和第二面的波长转换构件，其中从发光元件发射的光通过第一面进入，并且第二面的一部分用作发光面，其中发光元件进一步 包括在第二面的发光面周围的反射控制结构，反射控制结构在波长转换部件上具有反射膜，反射膜上具有防反射膜。