Invention Grant
- Patent Title: Connector having printed circuit with embedded die
- Patent Title (中): 具有嵌入式模具的印刷电路的连接器
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Application No.: US14752667Application Date: 2015-06-26
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Publication No.: US09455539B1Publication Date: 2016-09-27
- Inventor: Corey N. Axelowitz , Ling Zhang , Shawn Xavier Arnold
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent G. Victor Treyz; Joseph F. Guihan
- Main IPC: H01R13/66
- IPC: H01R13/66 ; H01R13/6581 ; H01L23/498 ; H01L25/065

Abstract:
An electrical connector may have connector contacts. Protection circuitry in the connector may prevent circuit damage. The protection circuitry may include diodes that shunt excessive voltages to ground. The protection circuitry may be implemented in a semiconductor die. The semiconductor die may be embedded within a substrate layer in a printed circuit. The printed circuit may form the body of the connector. Connector contacts may be formed on upper and lower surfaces of the printed circuit. Conductive structures such as vias in the printed circuit may be used to couple semiconductor die contacts on the semiconductor die to the connector contacts. The semiconductor die may be a double-sided die having first and second semiconductor dies that are bonded to each other in a back-to-back configuration.
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