公开(公告)号：US20140062469A1

公开(公告)日：2014-03-06

申请号：US13788541

申请日：2013-03-07

Applicant: APPLE INC.

Inventor： Henry H. Yang ,  Chiajen Lee ,  Shawn Xavier Arnold

IPC: G01R33/02

CPC classification number: G01R33/02 ,  G01C17/28 ,  G01R33/0206

Abstract: Electronic devices may be provided with magnetic sensors for detecting the Earth's magnetic field. The magnetic sensors may include thin magnetic sensors located in magnetically quiet regions of the device. The magnetic sensors may be attached to a device housing or a component such as a battery or a cover structure for a battery. The device may include unidirectional magnetic sensors aligned in three orthogonal directions or sensors with two or three magnetic sensor elements aligned in orthogonal directions. Magnetic field data from the three orthogonally aligned sensors or sensor elements may be combined to form directional compass data for the device. Each magnetic sensor may include one or more magnetic sensor elements for detecting the magnetic field and one or more shielded reference sensor elements for detecting environmental changes that can affect the magnetic sensor element. Reference sensor elements may be shared elements for multiple magnetic sensors elements.

Abstract translation: 电子设备可以设置有用于检测地球磁场的磁传感器。 磁传感器可以包括位于设备的磁安静区域中的薄磁传感器。 磁传感器可以附接到设备外壳或诸如电池的组件或用于电池的盖结构。 该装置可以包括在三个正交方向上对齐的单向磁性传感器或具有在正交方向上排列的两个或三个磁性传感器元件的传感器。 来自三个正交对准的传感器或传感器元件的磁场数据可以被组合以形成装置的定向罗盘数据。 每个磁传感器可以包括用于检测磁场的一个或多个磁传感器元件和用于检测可影响磁传感器元件的环境变化的一个或多个屏蔽参考传感器元件。 参考传感器元件可以是用于多个磁性传感器元件的共享元件。

公开(公告)号：US10455707B1

公开(公告)日：2019-10-22

申请号：US16100456

申请日：2018-08-10

Applicant: Apple Inc.

Inventor： Kenneth Leland Kiplinger ,  Mark J. Beesley ,  Shawn Xavier Arnold ,  Shyam Harindralal Ratnayake ,  Meng Chi Lee

IPC: H05K3/34 ,  H05K3/46 ,  H05K1/11 ,  H05K1/18 ,  H01L23/498

Abstract: Described herein are printed circuit boards (PCBs), PCB assemblies, and methods of manufacture thereof, which allow free placement of electrical components. The PCBs may have electrical pads that may couple to components through via-based connections and without the use of solder. The electrical components may be physically attached to the PCBs through tight fitting, lamination, and/or the use of adhesives. The distance between adjacent vias may be reduced, as accidental short-circuit risks due to solder bridging and similar effects are mitigated when the soldering process is bypassed. The PCB design and component placement may be flexible as to allow the use of electrical components with custom shape and/or customized terminal placement.

公开(公告)号：US09443830B1

公开(公告)日：2016-09-13

申请号：US14734951

申请日：2015-06-09

Applicant: Apple Inc.

Inventor： Corey N. Axelowitz ,  Eric C. Lee ,  Shawn Xavier Arnold

IPC: H01L25/065 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L23/3121 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83851 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15313 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Electrical components such as semiconductor die may be mounted in semiconductor packages and embedded within printed circuits. A printed circuit may have a substrate with an opening and may have metal layers. During lamination operations, substrate material such as prepreg may flow and form embedding dielectric material that embeds the semiconductor die within the opening. Double-sided semiconductor dies may be formed by attaching multiple semiconductor dies together using a layer of material such as die attach film. The double-sided semiconductor dies may be embedded within a printed circuit and mounted in semiconductor packages. Wire bond wires may be used to couple one of the semiconductor dies in a double-sided semiconductor die to contacts on a substrate. Wire bond wires may also be used to couple a shield layer to the substrate.

Abstract translation: 诸如半导体管芯的电气部件可以安装在半导体封装中并嵌入印刷电路中。 印刷电路可以具有带有开口的基底并且可以具有金属层。 在层压操作期间，诸如预浸料的基底材料可以流动并形成将半导体管芯嵌入开口内的电介质材料。 可以使用诸如管芯附着膜的材料层将多个半导体管芯附接在一起来形成双面半导体管芯。 双面半导体管芯可以嵌入印刷电路中并安装在半导体封装中。 引线键合线可以用于将双面半导体管芯中的半导体管芯中的一个耦合到衬底上的接触。 引线键合线也可用于将屏蔽层耦合到基板。

公开(公告)号：US09664747B2

公开(公告)日：2017-05-30

申请号：US13788541

申请日：2013-03-07

Applicant: Apple Inc.

Inventor： Henry H. Yang ,  Chiajen Lee ,  Shawn Xavier Arnold

IPC: G01R33/02 ,  G01C17/28

CPC classification number: G01R33/02 ,  G01C17/28 ,  G01R33/0206

Abstract: Electronic devices may be provided with magnetic sensors for detecting the Earth's magnetic field. The magnetic sensors may include thin magnetic sensors located in magnetically quiet regions of the device. The magnetic sensors may be attached to a device housing or a component such as a battery or a cover structure for a battery. The device may include unidirectional magnetic sensors aligned in three orthogonal directions or sensors with two or three magnetic sensor elements aligned in orthogonal directions. Magnetic field data from the three orthogonally aligned sensors or sensor elements may be combined to form directional compass data for the device. Each magnetic sensor may include one or more magnetic sensor elements for detecting the magnetic field and one or more shielded reference sensor elements for detecting environmental changes that can affect the magnetic sensor element. Reference sensor elements may be shared elements for multiple magnetic sensors elements.

公开(公告)号：US09455539B1

公开(公告)日：2016-09-27

申请号：US14752667

申请日：2015-06-26

Applicant: Apple Inc.

Inventor： Corey N. Axelowitz ,  Ling Zhang ,  Shawn Xavier Arnold

IPC: H01R13/66 ,  H01R13/6581 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/49844 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/04105 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/83851 ,  H01L2224/92244 ,  H01L2924/10253 ,  H01L2924/3025

Abstract: An electrical connector may have connector contacts. Protection circuitry in the connector may prevent circuit damage. The protection circuitry may include diodes that shunt excessive voltages to ground. The protection circuitry may be implemented in a semiconductor die. The semiconductor die may be embedded within a substrate layer in a printed circuit. The printed circuit may form the body of the connector. Connector contacts may be formed on upper and lower surfaces of the printed circuit. Conductive structures such as vias in the printed circuit may be used to couple semiconductor die contacts on the semiconductor die to the connector contacts. The semiconductor die may be a double-sided die having first and second semiconductor dies that are bonded to each other in a back-to-back configuration.

Abstract translation: 电连接器可以具有连接器触点。 连接器中的保护电路可能会阻止电路损坏。 保护电路可以包括将过多的电压分流到地的二极管。 保护电路可以在半导体管芯中实现。 半导体管芯可以嵌入印刷电路中的衬底层中。 印刷电路可以形成连接器的主体。 连接器触点可以形成在印刷电路的上表面和下表面上。 诸如印刷电路中的通孔的导电结构可以用于将半导体管芯上的半导体管芯接头连接到连接器触头。 半导体管芯可以是具有以背靠背配置彼此结合的第一和第二半导体管芯的双面管芯。

公开(公告)号：US09287049B2

公开(公告)日：2016-03-15

申请号：US13872000

申请日：2013-04-26

Applicant: Apple Inc.

Inventor： Gang Ning ,  Shawn Xavier Arnold ,  Jeffrey M. Thoma ,  Henry H. Yang

IPC: H01G4/35 ,  H01G4/30 ,  H01G4/232 ,  H05K3/34

CPC classification number: H01G4/35 ,  H01G4/2325 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10015

Abstract: The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.

Abstract translation: 所描述的实施例通常涉及用于安装在印刷电路板（PCB）上的电容器组件，更具体地涉及用于将电容器组件与PCB机械隔离的设计，以减少当电容器在PCB上施加压电力时产生的声学噪声。 电容器组件中的终端元件，包括电容器组件中的多孔导电层可以减少从电容器传递到PCB的振动能量。 包括软接触层的端接元件也可以减少传递到PCB的振动能量。 此外，具有增厚的介电材料的电容器组件可以减少传递到PCB的振动能量。