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公开(公告)号：US20220269640A1
公开(公告)日：2022-08-25
申请号：US17668512
申请日：2022-02-10
Applicant: Apple Inc.
Inventor： Ian P. Shaeffer , Eric C. Gaertner , John T. Orchard , Michael W. Murphy , Ronald P. Songco , Corey N. Axelowitz , Brett W. Degner
Abstract: A computer includes a processor, a PCIe-compatible interface bus that includes a root that is connected to the processor, and a routing complex that is connected to the root and is controlled by the processor. The computer also includes a first interface slot that is connectable to the root by the switches, a second interface slot that is connectable to the root by the switches, and an extended interface slot that is connectable to the root by the switches. The switches are configured based on properties of a first peripheral device to define a first switching configuration when the first peripheral device is connected only to the first interface slot and to define a second switching configuration when the first peripheral device is connected to both of the first interface slot and the extended interface slot.
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公开(公告)号：US20200311012A1
公开(公告)日：2020-10-01
申请号：US16815239
申请日：2020-03-11
Applicant: Apple Inc.
Inventor： Ian P. Schaeffer , Eric C. Gaertner , John T. Orchard , Michael W. Murphy , Ronald P. Songco , Corey N. Axelowitz , Brett W. Degner
Abstract: A computer includes a processor, a PCIe-compatible interface bus that includes a root that is connected to the processor, and a routing complex that is connected to the root and is controlled by the processor. The computer also includes a first interface slot that is connectable to the root by the switches, a second interface slot that is connectable to the root by the switches, and an extended interface slot that is connectable to the root by the switches. The switches are configured based on properties of a first peripheral device to define a first switching configuration when the first peripheral device is connected only to the first interface slot and to define a second switching configuration when the first peripheral device is connected to both of the first interface slot and the extended interface slot.
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公开(公告)号：US11741041B2
公开(公告)日：2023-08-29
申请号：US17668512
申请日：2022-02-10
Applicant: Apple Inc.
Inventor： Ian P. Shaeffer , Eric C. Gaertner , John T Orchard , Michael W. Murphy , Ronald P. Songco , Corey N. Axelowitz , Brett W. Degner
CPC classification number: G06F13/4282 , H01R12/737 , H01R13/6683 , G06F2213/0026 , H01R2201/06
Abstract: A computer includes a processor, a PCIe-compatible interface bus that includes a root that is connected to the processor, and a routing complex that is connected to the root and is controlled by the processor. The computer also includes a first interface slot that is connectable to the root by the switches, a second interface slot that is connectable to the root by the switches, and an extended interface slot that is connectable to the root by the switches. The switches are configured based on properties of a first peripheral device to define a first switching configuration when the first peripheral device is connected only to the first interface slot and to define a second switching configuration when the first peripheral device is connected to both of the first interface slot and the extended interface slot.
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公开(公告)号：US09443830B1
公开(公告)日：2016-09-13
申请号：US14734951
申请日：2015-06-09
Applicant: Apple Inc.
Inventor： Corey N. Axelowitz , Eric C. Lee , Shawn Xavier Arnold
IPC: H01L25/065 , H01L23/498
CPC classification number: H01L25/0657 , H01L23/3121 , H01L23/5385 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/13111 , H01L2224/16227 , H01L2224/16238 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/73267 , H01L2224/83851 , H01L2224/92144 , H01L2224/92244 , H01L2225/0651 , H01L2225/06517 , H01L2225/06537 , H01L2225/06541 , H01L2225/06555 , H01L2225/06558 , H01L2225/06568 , H01L2924/00014 , H01L2924/15313 , H01L2924/19107 , H01L2924/3025 , H01L2924/00012 , H01L2924/01029 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: Electrical components such as semiconductor die may be mounted in semiconductor packages and embedded within printed circuits. A printed circuit may have a substrate with an opening and may have metal layers. During lamination operations, substrate material such as prepreg may flow and form embedding dielectric material that embeds the semiconductor die within the opening. Double-sided semiconductor dies may be formed by attaching multiple semiconductor dies together using a layer of material such as die attach film. The double-sided semiconductor dies may be embedded within a printed circuit and mounted in semiconductor packages. Wire bond wires may be used to couple one of the semiconductor dies in a double-sided semiconductor die to contacts on a substrate. Wire bond wires may also be used to couple a shield layer to the substrate.
Abstract translation: 诸如半导体管芯的电气部件可以安装在半导体封装中并嵌入印刷电路中。 印刷电路可以具有带有开口的基底并且可以具有金属层。 在层压操作期间，诸如预浸料的基底材料可以流动并形成将半导体管芯嵌入开口内的电介质材料。 可以使用诸如管芯附着膜的材料层将多个半导体管芯附接在一起来形成双面半导体管芯。 双面半导体管芯可以嵌入印刷电路中并安装在半导体封装中。 引线键合线可以用于将双面半导体管芯中的半导体管芯中的一个耦合到衬底上的接触。 引线键合线也可用于将屏蔽层耦合到基板。
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公开(公告)号：US09991616B2
公开(公告)日：2018-06-05
申请号：US15158389
申请日：2016-05-18
Applicant: Apple Inc.
Inventor： Corey N. Axelowitz , William A. Tashman , James Y. Yap
CPC classification number: H01R12/79 , G06F1/1613 , H01R12/62 , H01R12/721 , H01R43/0256 , H05K1/147 , H05K3/363 , H05K2201/09063 , H05K2201/094
Abstract: The described embodiments relate generally to methods and apparatus for securely and efficiently joining components together. In some embodiments, a flexible printed circuit board and a rigid printed circuit board can be electrically coupled together by soldering electrical contacts distributed on the flexible printed circuit board to electrical contacts distributed on the rigid printed circuit board. The electrical contacts can be arranged and sized as desired to provide a desired amount of data and power transfer bandwidth.
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Patent Agency Ranking
公开(公告)号：US20170271799A1
公开(公告)日：2017-09-21
申请号：US15158389
申请日：2016-05-18
Applicant: Apple Inc.
Inventor： Corey N. Axelowitz , William A. Tashman , James Y. Yap
CPC classification number: H01R12/79 , G06F1/1613 , H01R12/62 , H01R12/721 , H01R43/0256 , H05K1/147 , H05K3/363 , H05K2201/09063 , H05K2201/094
Abstract: The described embodiments relate generally to methods and apparatus for securely and efficiently joining components together. In some embodiments, a flexible printed circuit board and a rigid printed circuit board can be electrically coupled together by soldering electrical contacts distributed on the flexible printed circuit board to electrical contacts distributed on the rigid printed circuit board. The electrical contacts can be arranged and sized as desired to provide a desired amount of data and power transfer bandwidth.
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公开(公告)号：US09955570B2
公开(公告)日：2018-04-24
申请号：US14975581
申请日：2015-12-18
Applicant: Apple Inc.
Inventor： Matthew W. Blum , Christine A. Laliberte , Corey N. Axelowitz , James Y. Yap
CPC classification number: H05K1/028 , H05K1/0216 , H05K1/0218 , H05K1/118 , H05K1/14 , H05K1/147 , H05K1/181 , H05K1/189 , H05K5/0247 , H05K2201/05 , H05K2201/056 , H05K2201/0715
Abstract: The subject matter of this disclosure relates to a flexible circuit for carrying a signal between electrical components that includes boosting circuitry for mitigating the effects of signal degradation. More particularly the flexible circuit can carry a signal between a main logic board and an input/output board supporting input/output ports of a portable electronic device. The flexible circuit can be configured with bends in order to meet packaging constraints such as avoiding contact with components obstructing a direct path between connectors of the electrical components. Additional bends can also be included in the flexible that facilitate the assembly of the portable electronic device.
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公开(公告)号：US09455539B1
公开(公告)日：2016-09-27
申请号：US14752667
申请日：2015-06-26
Applicant: Apple Inc.
Inventor： Corey N. Axelowitz , Ling Zhang , Shawn Xavier Arnold
IPC: H01R13/66 , H01R13/6581 , H01L23/498 , H01L25/065
CPC classification number: H01L23/49844 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/50 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/04105 , H01L2224/2919 , H01L2224/32145 , H01L2224/73267 , H01L2224/83851 , H01L2224/92244 , H01L2924/10253 , H01L2924/3025
Abstract: An electrical connector may have connector contacts. Protection circuitry in the connector may prevent circuit damage. The protection circuitry may include diodes that shunt excessive voltages to ground. The protection circuitry may be implemented in a semiconductor die. The semiconductor die may be embedded within a substrate layer in a printed circuit. The printed circuit may form the body of the connector. Connector contacts may be formed on upper and lower surfaces of the printed circuit. Conductive structures such as vias in the printed circuit may be used to couple semiconductor die contacts on the semiconductor die to the connector contacts. The semiconductor die may be a double-sided die having first and second semiconductor dies that are bonded to each other in a back-to-back configuration.
Abstract translation: 电连接器可以具有连接器触点。 连接器中的保护电路可能会阻止电路损坏。 保护电路可以包括将过多的电压分流到地的二极管。 保护电路可以在半导体管芯中实现。 半导体管芯可以嵌入印刷电路中的衬底层中。 印刷电路可以形成连接器的主体。 连接器触点可以形成在印刷电路的上表面和下表面上。 诸如印刷电路中的通孔的导电结构可以用于将半导体管芯上的半导体管芯接头连接到连接器触头。 半导体管芯可以是具有以背靠背配置彼此结合的第一和第二半导体管芯的双面管芯。
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公开(公告)号：US11281619B2
公开(公告)日：2022-03-22
申请号：US16815239
申请日：2020-03-11
Applicant: Apple Inc.
Inventor： Ian P. Schaeffer , Eric C. Gaertner , John T. Orchard , Michael W. Murphy , Ronald P. Songco , Corey N. Axelowitz , Brett W. Degner
Abstract: A computer includes a processor, a PCIe-compatible interface bus that includes a root that is connected to the processor, and a routing complex that is connected to the root and is controlled by the processor. The computer also includes a first interface slot that is connectable to the root by the switches, a second interface slot that is connectable to the root by the switches, and an extended interface slot that is connectable to the root by the switches. The switches are configured based on properties of a first peripheral device to define a first switching configuration when the first peripheral device is connected only to the first interface slot and to define a second switching configuration when the first peripheral device is connected to both of the first interface slot and the extended interface slot.
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公开(公告)号：US11188141B2
公开(公告)日：2021-11-30
申请号：US16127530
申请日：2018-09-11
Applicant: Apple Inc.
Inventor： Corey N. Axelowitz , William R. Allan, II , Eric C. Gaertner , Ian P. Shaeffer , Ronald P. Songco , John T. Orchard
IPC: G06F1/3296 , G06F1/3237 , H02M7/06
Abstract: Circuits, methods, and apparatus that may determine one or more characteristics relating to a mains power supply received by a computer system, and may then determine a maximum amount of power that may be drawn by the computer system given the determined characteristics. An example may provide a computer system having a power supply circuit that may include a detection circuit to receive a mains power supply and to detect a characteristic of the mains power supply. In response to the detected characteristic, the detection circuit may provide an output to a circuit in the computer system that sets a limit on a current that may be drawn by the circuit. In this example, the characteristic may be an RMS value of the mains power supply waveform, a location of where the mains power supply is being received, a quality of the mains power supply, or other characteristic.
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