公开(公告)号：US20240250211A1

公开(公告)日：2024-07-25

申请号：US18408246

申请日：2024-01-09

Applicant: Apple Inc.

Inventor： Erin C. Young ,  Ling Zhang ,  David P. Bour

IPC: H01L33/24 ,  H01L25/075 ,  H01L33/00 ,  H01L33/30

CPC classification number: H01L33/24 ,  H01L25/0753 ,  H01L33/0062 ,  H01L33/305

Abstract: Light emitting diodes with regrown semiconductor layers and methods of manufacture are described. In an embodiment, a light emitting diode includes a base structure including a first cladding layer doped with a first dopant type (e.g. n-type) and step surface. A mesa pillar including an active layer protrudes from the step surface, and a regrown second cladding layer doped with a second dopant type (e.g. p-type) is in direct contact with and spans a bottom surface and sidewalls of the mesa pillar and the step surface.

公开(公告)号：US20240012515A1

公开(公告)日：2024-01-11

申请号：US18212099

申请日：2023-06-20

Applicant: Apple Inc.

Inventor： Pablo Moreno Galbis ,  Xiang Lu ,  Bin Huang ,  Ling Zhang ,  Nikhil Acharya ,  Derek K. Shaeffer ,  Stanley B. Wang ,  Yongjie Jiang ,  Hopil Bae ,  Jiayi Jin ,  Ce Zhang ,  Young Don Bae ,  Giovanni Azzellino ,  Wooseung Yang ,  Mahdi Farrokh Baroughi ,  Weijun Yao ,  Rajesh Velayuthan ,  Eric A. Hildebrandt ,  Henry C. Jen

IPC: G06F3/041

CPC classification number: G06F3/0418 ,  G06F2203/04107 ,  G06F3/044

Abstract: Touch sensitive display technologies (e.g., integrated touch-display pixel-based systems) are evolving to contain more analog and digital circuits inside the panel itself instead of the traditionally simple thin-film transistors. This improves the display characteristics but makes those circuits more vulnerable to the impact of external ESD strikes, which can degrade the user experience. This disclosure describes a series of circuits and techniques to mitigate the impact of these discharges on front of screen artifacts and potential false touches. These circuits and techniques may include: performing configuration-only panel updates independently of the image refresh rate, improving the in-panel memory circuits to make them resistant to unexpected pin toggles via disabling of a write path in response to a read clock, implementing a pin corruption detector and implementing a supply injection detector.

公开(公告)号：US09455539B1

公开(公告)日：2016-09-27

申请号：US14752667

申请日：2015-06-26

Applicant: Apple Inc.

Inventor： Corey N. Axelowitz ,  Ling Zhang ,  Shawn Xavier Arnold

IPC: H01R13/66 ,  H01R13/6581 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/49844 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/04105 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/83851 ,  H01L2224/92244 ,  H01L2924/10253 ,  H01L2924/3025

Abstract: An electrical connector may have connector contacts. Protection circuitry in the connector may prevent circuit damage. The protection circuitry may include diodes that shunt excessive voltages to ground. The protection circuitry may be implemented in a semiconductor die. The semiconductor die may be embedded within a substrate layer in a printed circuit. The printed circuit may form the body of the connector. Connector contacts may be formed on upper and lower surfaces of the printed circuit. Conductive structures such as vias in the printed circuit may be used to couple semiconductor die contacts on the semiconductor die to the connector contacts. The semiconductor die may be a double-sided die having first and second semiconductor dies that are bonded to each other in a back-to-back configuration.

Abstract translation: 电连接器可以具有连接器触点。 连接器中的保护电路可能会阻止电路损坏。 保护电路可以包括将过多的电压分流到地的二极管。 保护电路可以在半导体管芯中实现。 半导体管芯可以嵌入印刷电路中的衬底层中。 印刷电路可以形成连接器的主体。 连接器触点可以形成在印刷电路的上表面和下表面上。 诸如印刷电路中的通孔的导电结构可以用于将半导体管芯上的半导体管芯接头连接到连接器触头。 半导体管芯可以是具有以背靠背配置彼此结合的第一和第二半导体管芯的双面管芯。