Invention Grant
- Patent Title: Wide interposer for an electronic testing system
- Patent Title (中): 宽插入式电子测试系统
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Application No.: US14157181Application Date: 2014-01-16
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Publication No.: US09459288B2Publication Date: 2016-10-04
- Inventor: Rianda Rizza
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: G01R1/073
- IPC: G01R1/073 ; G01R1/04 ; G01R31/28
Abstract:
A test interposer includes an interposer layer configured to receive a test socket, and a stiffening layer attached to the interposer layer so that the interposer layer is kept in an unalterable shape.
Public/Granted literature
- US20150198633A1 Wide Interposer for an Electronic Testing System Public/Granted day:2015-07-16
Information query
