Invention Grant
- Patent Title: Systems and methods for thermal mitigation with multiple processors
- Patent Title (中): 具有多个处理器的散热系统和方法
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Application No.: US13780259Application Date: 2013-02-28
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Publication No.: US09459879B2Publication Date: 2016-10-04
- Inventor: Sudhendra Kumar Gupta , Reza Shahidi , Shyamal Ramachandran
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Austin Rapp & Hardman
- Main IPC: G06F1/24
- IPC: G06F1/24 ; G06F9/00 ; G06F9/44 ; G06F9/48 ; H04M7/00 ; H04W52/02 ; G06F1/20 ; H04L12/28 ; H04W88/16 ; H04L12/10

Abstract:
A wireless communication device for thermal mitigation with multiple processors is described. The wireless communication device includes a first communications processor that processes a data call. The wireless communication device also includes a second communications processor coupled to the first communications processor. The first communications processor performs a thermal mitigation operation by sending instructions to the second communications processor when at least one thermal threshold is reached. The second communications processor receives and executes the instructions.
Public/Granted literature
- US20130332720A1 SYSTEMS AND METHODS FOR THERMAL MITIGATION WITH MULTIPLE PROCESSORS Public/Granted day:2013-12-12
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