Invention Grant
- Patent Title: Solder on trace technology for interconnect attachment
- Patent Title (中): 焊接跟踪技术的互连附件
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Application No.: US13787444Application Date: 2013-03-06
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Publication No.: US09461008B2Publication Date: 2016-10-04
- Inventor: Rajneesh Kumar , Omar J. Bchir
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Michelle S. Gallardo
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/48 ; H01L23/498 ; H05K3/34 ; H01L23/14
Abstract:
A solder on trace device includes a conductive trace on a semiconductor substrate surface. The conductive trace has a sidewall and a bonding surface. The solder on trace device also includes a passivation layer on at least one end of the conductive trace. The solder on trace device further includes a pre-solder material on the sidewall and the bonding surface of the conductive trace.
Public/Granted literature
- US20140048931A1 SOLDER ON TRACE TECHNOLOGY FOR INTERCONNECT ATTACHMENT Public/Granted day:2014-02-20
Information query
IPC分类:
