Invention Grant
- Patent Title: High throughput features in 11S mesh networks
-
Application No.: US14520828Application Date: 2014-10-22
-
Publication No.: US09462538B2Publication Date: 2016-10-04
- Inventor: Liwen Chu , George A. Vlantis , Vincenzo Scarpa
- Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS S.R.L.
- Applicant Address: US TX Coppell IT Agrate Brianza (MB)
- Assignee: STMICROELECTRONICS, INC.,STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS, INC.,STMICROELECTRONICS S.R.L.
- Current Assignee Address: US TX Coppell IT Agrate Brianza (MB)
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: H04L12/28
- IPC: H04L12/28 ; H04W48/14 ; H04W72/12 ; H04W84/18 ; H04W40/34 ; H04W48/08 ; H04W72/02 ; H04W84/12 ; H04W84/22

Abstract:
The addition of high throughput capability elements to beacon frames and peer link action frames in wireless mesh networks enable the utilization of desirable features without further modifications to the network. Rules can be established for high throughput mesh point protection in a mesh network, Space-time Block Code (STBC) operations and 20/40 MHz operation selections. However, features such as PSMP (power save multi-poll) and PCO (phased coexistence operations) are barred from implementation to prevent collisions.
Public/Granted literature
- US20150036543A1 HIGH THROUGHPUT FEATURES IN 11S MESH NETWORKS Public/Granted day:2015-02-05
Information query