Invention Grant
- Patent Title: System on chip with embedded security module
- Patent Title (中): 带嵌入式安全模块的片上系统
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Application No.: US14137065Application Date: 2013-12-20
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Publication No.: US09471793B2Publication Date: 2016-10-18
- Inventor: Markus Gail , Gerd Dirscherl , Marcus Janke
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: G06F7/04
- IPC: G06F7/04 ; G06F21/60 ; G06F21/00 ; G06F21/71

Abstract:
An embedded security module includes a security processor, volatile and non-volatile memory, and an interface. The security processor includes transistors formed in one or more semiconductor layers of a semiconductor die, and implements one or more security-related functions on data and/or code accessed by the security processor. The volatile memory is fabricated on the same semiconductor die as the security processor and stores the data and/or code accessed by the security processor. The non-volatile memory includes non-volatile storage cells disposed above each semiconductor layer of the semiconductor die, and securely stores at least one of the data and/or code accessed by the security processor and security information relating to the data and/or code accessed by the security processor. The interface is fabricated on the same semiconductor die as the security processor and provides a communication interface for the security processor.
Public/Granted literature
- US20140223569A1 System on Chip with Embedded Security Module Public/Granted day:2014-08-07
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