公开(公告)号：US20210097798A1

公开(公告)日：2021-04-01

申请号：US17034710

申请日：2020-09-28

Applicant: Infineon Technologies AG

Inventor： Peter Laackmann ,  Markus Gail

IPC: G07F13/02 ,  G07F9/00 ,  G06F21/44

Abstract: A consumable component apparatus including a receptacle region for receiving configured to receive a substance or material which is consumed under the control of a consumer device, an authentication circuit configured to authenticate the consumer device, and a switch coupled to the authentication circuit. The authentication circuit is configured to control the switch in such a way that the consumable component apparatus is activatable only if the consumer device is authenticated by means of the authentication circuit, and that the consumable component apparatus is deactivated if the consumer device is not authenticated by means of the authentication circuit.

公开(公告)号：US09471793B2

公开(公告)日：2016-10-18

申请号：US14137065

申请日：2013-12-20

Applicant: Infineon Technologies AG

Inventor： Markus Gail ,  Gerd Dirscherl ,  Marcus Janke

IPC: G06F7/04 ,  G06F21/60 ,  G06F21/00 ,  G06F21/71

CPC classification number: G06F21/60 ,  G06F21/00 ,  G06F21/71 ,  G06F2221/2121

Abstract: An embedded security module includes a security processor, volatile and non-volatile memory, and an interface. The security processor includes transistors formed in one or more semiconductor layers of a semiconductor die, and implements one or more security-related functions on data and/or code accessed by the security processor. The volatile memory is fabricated on the same semiconductor die as the security processor and stores the data and/or code accessed by the security processor. The non-volatile memory includes non-volatile storage cells disposed above each semiconductor layer of the semiconductor die, and securely stores at least one of the data and/or code accessed by the security processor and security information relating to the data and/or code accessed by the security processor. The interface is fabricated on the same semiconductor die as the security processor and provides a communication interface for the security processor.

Abstract translation: 嵌入式安全模块包括安全处理器，易失性和非易失性存储器以及接口。 安全处理器包括形成在半导体管芯的一个或多个半导体层中的晶体管，并且对由安全处理器访问的数据和/或代码实现一个或多个与安全相关的功能。 易失性存储器被制造在与安全处理器相同的半导体管芯上，并存储由安全处理器访问的数据和/或代码。 非易失性存储器包括设置在半导体芯片的每个半导体层之上的非易失性存储单元，并且安全地存储由安全处理器访问的数据和/或代码中的至少一个以及与数据和/或代码相关的安全信息 由安全处理器访问。 该接口在与安全处理器相同的半导体管芯上制造，并为安全处理器提供通信接口。

公开(公告)号：US20140223569A1

公开(公告)日：2014-08-07

申请号：US14137065

申请日：2013-12-20

Applicant: Infineon Technologies AG

Inventor： Markus Gail ,  Gerd Dirscherl ,  Marcus Janke

IPC: G06F21/60

CPC classification number: G06F21/60 ,  G06F21/00 ,  G06F21/71 ,  G06F2221/2121

Abstract: An embedded security module includes a security processor, volatile and non-volatile memory, and an interface. The security processor includes transistors formed in one or more semiconductor layers of a semiconductor die, and implements one or more security-related functions on data and/or code accessed by the security processor. The volatile memory is fabricated on the same semiconductor die as the security processor and stores the data and/or code accessed by the security processor. The non-volatile memory includes non-volatile storage cells disposed above each semiconductor layer of the semiconductor die, and securely stores at least one of the data and/or code accessed by the security processor and security information relating to the data and/or code accessed by the security processor. The interface is fabricated on the same semiconductor die as the security processor and provides a communication interface for the security processor.

Abstract translation: 嵌入式安全模块包括安全处理器，易失性和非易失性存储器以及接口。 安全处理器包括形成在半导体管芯的一个或多个半导体层中的晶体管，并且对由安全处理器访问的数据和/或代码实现一个或多个与安全相关的功能。 易失性存储器被制造在与安全处理器相同的半导体管芯上，并存储由安全处理器访问的数据和/或代码。 非易失性存储器包括设置在半导体芯片的每个半导体层之上的非易失性存储单元，并且安全地存储由安全处理器访问的数据和/或代码中的至少一个以及与数据和/或代码相关的安全信息 由安全处理器访问。 该接口在与安全处理器相同的半导体管芯上制造，并为安全处理器提供通信接口。