Invention Grant
- Patent Title: Method of forming a semiconductor device structure and such a semiconductor device structure
- Patent Title (中): 形成半导体器件结构的方法和这种半导体器件结构
-
Application No.: US14693978Application Date: 2015-04-23
-
Publication No.: US09472642B2Publication Date: 2016-10-18
- Inventor: Jan Hoentschel , Stefan Flachowsky , Ralf Richter , Peter Javorka
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L21/283 ; H01L29/78 ; H01L29/06 ; H01L29/45

Abstract:
The present disclosure provides in one aspect for a semiconductor device structure which may be formed by providing source/drain regions within a semiconductor substrate in alignment with a gate structure formed over the semiconductor substrate, wherein the gate structure has a gate electrode structure, a first sidewall spacer and a second sidewall spacer, the first sidewall spacer covering sidewall surfaces of the gate electrode structure and the sidewall spacer being formed on the first sidewall spacer. Furthermore, forming the semiconductor device structure may include removing the second sidewall spacer so as to expose the first sidewall spacer, forming a third sidewall spacer on a portion of the first sidewall spacer such that the first sidewall spacer is partially exposed, and forming silicide regions in alignment with the third sidewall spacer in the source/drain regions.
Public/Granted literature
- US20160163815A1 METHOD OF FORMING A SEMICONDUCTOR DEVICE STRUCTURE AND SUCH A SEMICONDUCTOR DEVICE STRUCTURE Public/Granted day:2016-06-09
Information query
IPC分类: