Invention Grant
- Patent Title: Performance state boost for multi-core integrated circuit
- Patent Title (中): 多核集成电路的性能状态提升
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Application No.: US14053315Application Date: 2013-10-14
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Publication No.: US09483092B2Publication Date: 2016-11-01
- Inventor: Samuel Naffziger , Baomin Liu , Maxat Touzelbaev
- Applicant: Advanced Micro Devices, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Polansky & Associates, P.L.L.C.
- Agent Paul J. Polansky
- Main IPC: G06F1/26
- IPC: G06F1/26 ; G06F1/32

Abstract:
An integrated circuit includes a multiple number of processor cores and a system management unit. The multiple number of processor cores each operate at one of a multiple number of performance states. The system management unit is coupled to the multiple number of processor cores, for setting performance states of the multiple number of processor cores. The system management unit boosts a first performance state of a first processor core of the multiple number of processor cores based on both a first temperature calculated from an estimated power consumption, and a second temperature based on a temperature measurement.
Public/Granted literature
- US20150106642A1 PERFORMANCE STATE BOOST FOR MULTI-CORE INTEGRATED CIRCUIT Public/Granted day:2015-04-16
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