Invention Grant
- Patent Title: Chip component and method of producing the same
- Patent Title (中): 芯片部件及其制造方法
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Application No.: US14376417Application Date: 2013-01-08
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Publication No.: US09484135B2Publication Date: 2016-11-01
- Inventor: Yasuhiro Kondo , Hiroshi Tamagawa , Hiroki Yamamoto
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2012-022296 20120203; JP2012-042300 20120228; JP2012-067970 20120323; JP2012-081627 20120330; JP2012-277079 20121219
- International Application: PCT/JP2013/050082 WO 20130108
- International Announcement: WO2013/114912 WO 20130808
- Main IPC: H01C10/00
- IPC: H01C10/00 ; H01C10/50 ; H01C1/14 ; H01C13/02 ; H01C17/06 ; H01G4/40 ; H01G2/16 ; H01C17/00 ; H01F27/40 ; H01G5/38 ; H01L27/02 ; H01L27/08

Abstract:
[Subject] To provide a highly-reliable and small-size chip component, e.g., a chip resistor having an accurate resistance value.[Solution] The chip resistor (10) includes: a substrate (11); a plurality of resistor elements each having a resistive film portion (20) provided on the substrate (11) and an aluminum-containing interconnection film portion (21) provided in contact with the resistive film portion (20); electrodes (12, 13) provided on the substrate (11); and a plurality of fuses (F) each having an aluminum-containing interconnection film portion integral with the aluminum-containing interconnection film portion of the resistor element and disconnectably connecting the resistor element to the electrodes (12, 13).[Effect] The resistance of the chip resistor can be adjusted at a desired resistance value by selectively disconnecting desired ones of the fuses. Since the fuses are formed in a minute layout pattern from an aluminum-containing interconnection film, the processing accuracy is improved in the disconnecting step.
Public/Granted literature
- US20140368965A1 CHIP COMPONENT AND METHOD OF PRODUCING THE SAME Public/Granted day:2014-12-18
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