Invention Grant
US09484196B2 Semiconductor structures including liners comprising alucone and related methods
有权
半导体结构，包括含有alucone的衬垫和相关方法
- Patent Title: Semiconductor structures including liners comprising alucone and related methods
- Patent Title (中): 半导体结构，包括含有alucone的衬垫和相关方法
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Application No.: US14189323Application Date: 2014-02-25
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Publication No.: US09484196B2Publication Date: 2016-11-01
- Inventor: Zhe Song , Tuman E. Allen , Cole S. Franklin , Dan Gealy
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L45/00 ; H01L27/115 ; H01L21/033 ; H01L27/24
Abstract:
A semiconductor device including stacked structures. The stacked structures include at least two chalcogenide materials or alternating dielectric materials and conductive materials. A liner including alucone is formed on sidewalls of the stacked structures. Methods of forming the semiconductor device are also disclosed.
Public/Granted literature
- US20150243709A1 SEMICONDUCTOR STRUCTURES INCLUDING LINERS COMPRISING ALUCONE AND RELATED METHODS Public/Granted day:2015-08-27
Information query
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