Invention Grant
- Patent Title: Light emitting device
- Patent Title (中): 发光装置
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Application No.: US14318320Application Date: 2014-06-27
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Publication No.: US09484507B2Publication Date: 2016-11-01
- Inventor: Daisuke Iwakura
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2013-137500 20130628
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/50 ; H01L33/54

Abstract:
A light emitting device comprises a package having a recess; a light emitting element mounted in the recess of the package; a light transmissive member provided above the light emitting element; a sealing resin that seals the recess of the package; and a fluorescent material contained in the sealing resin. The fluorescent material is distributed to a side of the light emitting element in a greater amount than to above the light emitting element, a side surface of the light emitting element is exposed to the sealing resin, and a portion of the light transmissive member protrudes from the sealing resin.
Public/Granted literature
- US20150001565A1 LIGHT EMITTING DEVICE Public/Granted day:2015-01-01
Information query
IPC分类: