发明授权
- 专利标题： Heat treatment apparatus
- 专利标题（中）： 热处理设备
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申请号： US13550638申请日： 2012-07-17
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公开(公告)号： US09490104B2公开(公告)日： 2016-11-08
- 发明人: Ken'etsu Yokogawa , Masatoshi Miyake , Takashi Uemura , Masaru Izawa , Satoshi Sakai
- 申请人： Ken'etsu Yokogawa , Masatoshi Miyake , Takashi Uemura , Masaru Izawa , Satoshi Sakai
- 申请人地址： JP Tokyo
- 专利权人： HITACHI HIGH-TECHNOLOGIES CORPORATION
- 当前专利权人： HITACHI HIGH-TECHNOLOGIES CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Baker Botts L.L.P.
- 优先权： JP2011-244083 20111108; JP2012-092883 20120416
- 主分类号： B23K9/00
- IPC分类号： B23K9/00 ; H01J37/32 ; H01L21/324 ; H01L21/67
摘要：
Provided is a heat treatment apparatus that is high in thermal efficiency and can reduce surface roughness of a substrate to be treated even when a specimen is heated at 1200° C. or higher.The heat treatment apparatus heating the specimen includes a heating plate heated by plasma formed in an area of a gap to heat the specimen.
公开/授权文献
- US20130112670A1 HEAT TREATMENT APPARATUS 公开/授权日：2013-05-09