Invention Grant
- Patent Title: Resin composition, and printed circuit board using same
- Patent Title (中): 树脂组合物和使用其的印刷电路板
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Application No.: US14651771Application Date: 2013-12-06
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Publication No.: US09504147B2Publication Date: 2016-11-22
- Inventor: Yeo Eun Yoon , Myeong Jeong Kim , Sungjin Yun , Sanga Ju
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2012-0144787 20121212
- International Application: PCT/KR2013/011312 WO 20131206
- International Announcement: WO2014/092401 WO 20140619
- Main IPC: H05K1/05
- IPC: H05K1/05 ; B32B15/092 ; B32B27/20 ; B32B27/26 ; B32B27/38 ; C08G59/24 ; C08G59/50 ; C08L63/00 ; C08K3/22 ; H05K1/03 ; C08G59/22
Abstract:
According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (Al2O3) groups classified by particle size.
Public/Granted literature
- US20150319855A1 RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME Public/Granted day:2015-11-05
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