Invention Grant
- Patent Title: Liquid deposition composition and process for forming metal therefrom
- Patent Title (中): 液体沉积组合物及其形成金属的方法
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Application No.: US14645366Application Date: 2015-03-11
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Publication No.: US09506149B2Publication Date: 2016-11-29
- Inventor: Owen J. Hildreth
- Applicant: NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
- Applicant Address: US DC Washington
- Assignee: THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
- Current Assignee: THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
- Current Assignee Address: US DC Washington
- Agent Toby D. Hain
- Main IPC: B05D5/12
- IPC: B05D5/12 ; C23C18/16 ; H01L21/3205 ; H01Q17/00 ; H01Q1/38 ; H01L21/306 ; H01L21/3063 ; H01L21/3065 ; B81C1/00
Abstract:
A process for depositing a metal includes disposing a liquid deposition composition on a substrate, the liquid deposition composition including a metal cation; a reducing anion; anda solvent; evaporating the solvent; increasing a concentration of the reducing anion increases in the liquid deposition composition due to evaporating the solvent; performing an oxidation-reduction reaction between the metal cation and the reducing anion in response to increasing the concentration of the reducing anion when the reducing anion is present at a critical concentration; and forming a metal from the metal cation to deposit the metal on the substrate.
Public/Granted literature
- US20150191825A1 LIQUID DEPOSITION COMPOSITION AND PROCESS FOR FORMING METAL THEREFROM Public/Granted day:2015-07-09
Information query
