- 专利标题： Microelectronic package having direct contact heat spreader and method of manufacturing same
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申请号： US13973975申请日： 2013-08-22
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公开(公告)号： US09508675B2公开(公告)日： 2016-11-29
- 发明人: Daoqiang Lu , Chuan Hu , Gilroy J. Vandentop , Shriram Ramanathan , Rajashree Baskaran , Valery M. Dubin
- 申请人： Daoqiang Lu , Chuan Hu , Gilroy J. Vandentop , Shriram Ramanathan , Rajashree Baskaran , Valery M. Dubin
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/48 ; H01L23/373 ; H01L21/00
摘要：
A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.
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