Invention Grant
- Patent Title: Method and apparatus for controlling chip performance
- Patent Title (中): 控制芯片性能的方法和装置
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Application No.: US13870744Application Date: 2013-04-25
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Publication No.: US09509293B2Publication Date: 2016-11-29
- Inventor: Xiangpeng Li , Yu Liu , Cong Yao
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: CN201210126761 20120426
- Main IPC: H03B19/00
- IPC: H03B19/00 ; H03K5/00 ; G06F1/20 ; G06F1/32

Abstract:
Embodiments of the present invention disclose a method and an apparatus for controlling chip performance, and relate to the field of communications technologies, which solves a problem in the prior art that a chip is reset or performance is greatly decreased as long as a temperature of the chip is higher than a preset threshold. The method includes: obtaining a working temperature of a chip; when the working temperature of the chip reaches one of multiple preset temperature thresholds, obtaining, according to preset correspondence between a temperature threshold and a chip performance control policy, a chip performance control policy that corresponds to the one of the multiple temperature thresholds; and controlling working of the chip according to the control policy. The present invention is applicable to an electronic device to which a chip is applied, such as a desktop computer or a notebook computer.
Public/Granted literature
- US20130293269A1 METHOD AND APPARATUS FOR CONTROLLING CHIP PERFORMANCE Public/Granted day:2013-11-07
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