发明授权
- 专利标题： Stack frame for electrical connections and the method to fabricate thereof
- 专利标题（中）： 用于电气连接的堆叠框架及其制造方法
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申请号： US14821812申请日： 2015-08-10
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公开(公告)号： US09514964B2公开(公告)日： 2016-12-06
- 发明人: Bau-Ru Lu , Da-Jung Chen , Yi-Cheng Lin
- 申请人： Bau-Ru Lu , Da-Jung Chen , Yi-Cheng Lin
- 申请人地址： TW Hsinchu
- 专利权人： CYNTEC Co., Ltd.
- 当前专利权人： CYNTEC Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Litron Patent & Trademark Office
- 代理商 Min-Lee Teng
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/48 ; H01L23/495 ; H01L21/768 ; H01L25/00 ; H01L25/16 ; H01L23/00
摘要：
A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.
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