Invention Grant
- Patent Title: Stack frame for electrical connections and the method to fabricate thereof
- Patent Title (中): 用于电气连接的堆叠框架及其制造方法
-
Application No.: US14821812Application Date: 2015-08-10
-
Publication No.: US09514964B2Publication Date: 2016-12-06
- Inventor: Bau-Ru Lu , Da-Jung Chen , Yi-Cheng Lin
- Applicant: Bau-Ru Lu , Da-Jung Chen , Yi-Cheng Lin
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC Co., Ltd.
- Current Assignee: CYNTEC Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Litron Patent & Trademark Office
- Agent Min-Lee Teng
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/48 ; H01L23/495 ; H01L21/768 ; H01L25/00 ; H01L25/16 ; H01L23/00
Abstract:
A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.
Public/Granted literature
- US20150348801A1 STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE THEREOF Public/Granted day:2015-12-03
Information query
IPC分类:
