Invention Grant
- Patent Title: Optically enabled multi-chip modules
- Patent Title (中): 光功能多芯片模块
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Application No.: US14500212Application Date: 2014-09-29
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Publication No.: US09515746B2Publication Date: 2016-12-06
- Inventor: Frank J. Flens , Daniel Mahgerefteh , The′ Linh Nguyen , Jimmy Alan Tatum
- Applicant: FINISAR CORPORATION
- Applicant Address: US CA Sunnyvale
- Assignee: FINISAR CORPORATION
- Current Assignee: FINISAR CORPORATION
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Brennan
- Main IPC: H04B10/00
- IPC: H04B10/00 ; H04B10/80

Abstract:
An optically enabled multi-chip module has an optical engine transceiver and a host system chip. The optical engine transceiver has an optical engine front-end and an optical engine macro. The optical engine front-end has multiple laser diodes, laser driver circuitry electrically interfaced with each of the laser diodes, multiple photodiodes, amplifier circuitry electrically interfaced with each of the photodiodes, and at least one optical element optically positioned between the laser diodes and at least one optical fiber and between the photodiodes and the at least one optical fiber. The at least one optical element optically interfaces the laser diodes and photodiodes with the optical fiber. The optical engine macro is both electrically interfaced with and physically segregated from the optical engine front-end. The optical engine macro provides a subset of optical transceiver functionality to the optical engine front-end. The host system chip is electrically interfaced with the optical engine transceiver.
Public/Granted literature
- US20150090864A1 OPTICALLY ENABLED MULTI-CHIP MODULES Public/Granted day:2015-04-02
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