Invention Grant
US09524883B2 Holding of interposers and other microelectronic workpieces in position during assembly and other processing
有权
在组装和其他加工过程中保持插入件和其他微电子工件的位置
- Patent Title: Holding of interposers and other microelectronic workpieces in position during assembly and other processing
- Patent Title (中): 在组装和其他加工过程中保持插入件和其他微电子工件的位置
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Application No.: US14535159Application Date: 2014-11-06
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Publication No.: US09524883B2Publication Date: 2016-12-20
- Inventor: Charles G. Woychik , Eric S. Tosaya , Rajesh Katkar
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L25/00 ; H01L25/065 ; H01L21/683 ; H01L23/13 ; H01L23/498
Abstract:
A workpiece (120) has protruding conductive features (140) at least on a first side. The second side is processed while the workpiece is held from the first side by a holder (220H). To prevent damage to the protruding features and flatten the workpiece (which could be otherwise warped), a spacer (210) is inserted between the workpiece and the holder. The spacer has holes (250) receiving the protruding features. The workpiece can be held by forces generated by the holder such as vacuum or an electrostatic force, without an adhesive. Other features and advantages are provided.
Public/Granted literature
Information query
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